FIB

start:

1: wear hand cover n put unit inside the machine after baked the unit.
2: load + on Ebean + on Ibean
3. use Ebean to perform usentric.
3: adjust XY axis to 0.
4: bend the track by using a location on die as reference.
5. use joystick + button to adjust, 1",2", 5", 8" (click Z->FLW), then 26",40+",52" (remember x-align + keep focus)
6. move to the location required to probe or mill.
7. use ibean for following. (not sure for ibean power, if not mistaken is 150k.. will confirm later..)

mill if there is oxide layer
1. use SI.MPLT
2. adjust X: 0.8 and Y: 1.5 and Z: 2
3: remember to turn to IBEAN image and zoom in the location big enough
4. start milling
5. observe the milling hole and stop if the hole is big enough by refering to the oscilloscope and the curve (click endpoint to open and stop right after first overshoot)

probe point
1. use P.MPLT
2. use IBEAN image and put the box. (X:2.5 n Y: 7 n Z: 0.3)
3. tick PLT to insert the needle.
4. start probing
5. after finished remember to release the needle
6. use Ibean video and insert IEE to etch extra material.
7. release IEE

finish
1. turn off ibean n ebean
2.unload n pick up the unit.

ADDITIONAL
cross-sectioning
1. after usentric, move to location which required to execute.
2. use P.MPLT to put a layer on the location with 0.2 thick. (remember pull out needle)
3. use SI.MPLT to drill a hole at the bottom of the defect location. (size as large as the defect area)
4. use oso SI.MPLT perform cross-section with the c-s icon. (just right up after the drill hole)

important:
1. needle
2. oscilloscope