parametric analysis

Parametric failure

non-destructive analysis

failed open
1. send for Csam analysis
2. send for X-ray inspection
3. TDR analysis if the unit consist of iron ball at bottom of the unit.

failed short
1. TDR analysis if the unit consist of iron ball at bottom of the unit.

destructive analysis

decapsulation first
1. observe the bond pad of failing pin.
2. observe the electrical routing path of failing pin
3. observe the output buffer of failing pin

further analysis 1
1. liquid crystal
2. VBA
3 light emission

further analysis 2
submarine first
1. parallel lapping (approximate 8 minutes for oxide removal)
2. observation for every level exposed during parallel lapping

further analysis 3
Aqua regia first
1. SEM
2. wright etch + SEM

additional information:
for adjacent opened failure, cross section analysis can be performed upon further analysis 1.
failure mechanism for open/short normally related to EOS, ESD, carbonized mold compound, lifted wire, wire touching, and somemore( will add in next time)

observe slowly and carefully  is the key to success